Appeal No. 96-3106
Application 08/052,015
1. A semiconductor package, comprising:
an electrically conductive package support member having
a central aperture therethrough;
a central electrode structure extending through the
central aperture of the package support member and
electrically isolated therefrom;
a plurality of semiconductor devices disposed on the
package support member in an array surrounding the central
electrode structure, each semiconductor device including first
and second electrodes wherein the first electrodes of the
semiconductor devices are electrically interconnected by the
support member; and
a first terminal electrically connected to the package
support member;
wherein the central electrode structure includes a bus
for electrically interconnecting the second electrodes of the
semiconductor devices and a second terminal is coupled to the
bus.
The Examiner relies on the following references:
Sutrina 4,614,964 Sep. 30, 1986
Granberg et al. (Granberg) 4,639,760 Jan. 27, 1987
Claim 19 stands rejected under 35 U.S.C. § 112, first
paragraph, as not describing the claimed invention in such
full, clear, concise and exact terms as to enable any person
skilled in the art to make and use the same, and for failure
to provide an clear written description. Claim 19 further
stands rejected under 35 U.S.C. § 112, second paragraph for
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