Appeal No. 96-3357
Application 08/292,491
17 through 22 have been indicated as allowable. 2
The invention concerns a laminated or multilayer circuit
board having an integral insulated mounting area for a
packaged electrical device and a heat sink area. The surface
mount package can be soldered directly to the mounting area,
and a heat sink can be soldered directly to the heat sink
area. The package contains an electrical device. The
invention eliminates any need for hardware for attaching the
heat sink and the surface mount package to the multilayer
circuit board.
Representative claim 1 is reproduced as follows:
1. A multilayer circuit board for receiving a surface
mount package having a lead frame, the multilayer circuit
board comprising:
a first circuit board layer having a first top surface
and a first bottom surface, the first top surface having a
surface mount pad for physical and electrical connection to
the lead frame, the bottom surface having a heat sink area
opposite the surface mount pad; and
a second circuit board layer having a second top surface
2There were two amendments after the final rejection.
Amendment filed on November 7, 1995, [Paper No. 7] was not
entered in the record, but that filed on March 12, 1996,
[Paper No. 12] was entered.
2
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