Appeal No. 96-3357
Application 08/292,491
Examiner under 35 U.S.C. § 102 over Kuo or Brown. [Answer,
page 3]. We have likewise reviewed Appellant’s argument
regarding each of these applied references. [Brief, pages 10
to 14]. We now consider the rejection of claim 1. The
Examiner, on page 3 of the answer, states: “Concerning claim 1
... and Kuo et al [sic], first layer 22, 24, 32, etc [sic]
with pad 38 and a bottom `area’ for spreader 18 is shown. The
second layer reads on any of the upper 32 layers which are
shorter and expose the package through the central opening.”
The Examiner in his interpretation of the claim has ignored
the term “surface mount package” in the preamble of the claim.
This would have been justified if this term or its resultant
were not incorporated in the body of the claim. But, here, we
agree with Appellant in that the invention is dedicated to the
efficient surface mounting of an electronic device on a
circuit board to accomplish maximum heat transfer without the
need for additional hardware as is required by the prior art.
[Brief, pages 11 and 12]. A surface mounted device or package
is defined as “a device, the entire body of which projects in
front of the mounting surface.” The IEEE Standard Dictionary
of Electrical & Electronic Terms, Sixth Edition, published by
5
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007