Appeal No. 96-3357
Application 08/292,491
and a second bottom surface, the second bottom surface being
attached to the first top surface, the second circuit board
layer being configured so that the surface mount pad is
exposed, whereby heat is dissipated from the lead frame of the
surface mount package through the first circuit board layer to
the heat sink area.
The references relied on by the examiner are:
Brown 4,729,061 Mar. 1, 1988
Kuo et al.(Kuo) 4,731,701 Mar. 15, 1988
Claims 1 through 5 and 23 stand rejected under 35 U.S.C.
§ 102. As evidence for the § 102 rejection, the Examiner3
offers in the alternative Kuo and Brown.
Reference is made to Appellant’s brief and the Examiner's
answer for their respective positions.
OPINION
We have considered the record before us. We will reverse
the rejections of claims 1 through 5 and 23.
Rejections Under 35 U.S.C. § 102
3The Examiner has withdrawn all the rejections under 35
U.S.C. § 112, second paragraph, thus leaving only these
rejections under 35 U.S.C. § 102 for appeal here.
3
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