Ex parte TSUTAKI et al. - Page 2




          Appeal No. 96-3612                                                          
          Application 08/161,869                                                      


          including all of the limitations of the base claim and any                  
          intervening claims (Answer, pages 1, 2, 13 and 14).                         
          Accordingly, claims 12 through 14, 16 through 18 and 24                     
          through 27 remain before us on appeal.                                      
               The disclosed invention relates to a magnetic head                     
          assembly, and to a method for manufacturing the same.  The                  
          magnetic head has a die-molded rotatable head base formed from              
          a conductive resin material.  An outer surface of the head                  
          base defines a housing envelope for a head chip buried                      
          therein.                                                                    
               Claim 12 is illustrative of the claimed invention, and it              
          reads as follows:                                                           
               12.  A magnetic head comprising:                                       
               a die-molded rotatable head base formed from a conductive              
          resin material and presenting an outer surface defining a                   
          housing envelope formed in said head base, said head base                   
          having an aperture therethrough generally defining an axis of               
          rotation thereof; and                                                       
               a head chip comprising a magnetic substance and having at              
          least a portion thereof buried within said housing envelope so              
          that said magnetic substance is in contact with said outer                  
          surface defining said housing envelope in a manner which                    
          secures said head chip to said head base, said housing                      
          envelope formed in said head base defining a relative position              
          of said head chip with respect to said axis of rotation of                  
          said head base.                                                             




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