Ex parte SHOR et al. - Page 13




          Appeal No. 96-4052                                                          
          Application 08/198,511                                                      

          material" (Br10).  Appellants argue that Kohl involves                      
          photoelectrochemical etching of p-type semiconductor                        
          compounds, whereas claim 31 recites an n-type material (Br5).               
               Kohl discloses a photoelectrochemical etching process                  
          where "[a] mask 27 may be used on the surface of the                        
          semiconductor to define the area illuminated by radiation"                  
          (col. 5, lines 54-56).  Kohl discloses that "[t]he mask metal               
          may be used as the electrical contact to the semiconductor"                 
          (col. 5, lines 59-60).  The mask in Kohl would have suggested               
          the use of such a mask in Forrest since both are                            
          photoelectrochemical etching processes.  The difference in                  
          conductivity types of the material being etched, p-type in                  
          Kohl versus n-type in Forrest, does not negate the teaching of              
          using a mask on the material.  It is also considered                        
          notoriously well known in the semiconductor manufacturing art               
          to used mask layers to selectively control the area exposed.                
          The rejection of claims 40 and 41 is sustained.                             
               Ultraviolet (UV) light is recited in claims 42 and 46.                 
          These claims are not argued by appellants and we will not                   
          address issues not argued in the brief.  See 37 CFR                         
          § 1.192(c)(8)(iv) (errors must be addressed in brief).  Cf.                 

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