Appeal No. 1997-0439
Application 08/348,414
to 17 have been canceled.
BACKGROUND
The subject matter on appeal is directed to optical waveguides and corner coupling of
electronic devices using an interconnect substrate (see specification, page 1). More specifically,
appellants disclose an interconnect substrate (see appellants’ Figure 1) and a method of making an
interconnect substrate having a cleaved end surface which creates a corner edge contact (see
specification, pages 1 to 2; Brief, page 3). Appellants recognized that by cutting or cleaving a channel
109 in an end surface 105 and an upper surface 104 after an electrically conductive material (e.g.,
solder) has been added, electronic devices 152 can be more easily connected and coupling can be
performed more easily and efficiently (see specification, page 1).
Representative independent apparatus claim 8 is reproduced below:
8. An interconnect substrate comprising:
a substrate having a first surface with an electrical trace;
a channel formed in the first surface and filled with an electrically conductive material;
the substrate being cut through the first surface and the channel to form an end surface, the
channel and the electrically conductive material defining a contact in the end surface and a contact in the
first surface; and
the electrical trace being operably coupled to the electrically conductive material in the channel.
2
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007