Appeal No. 1997-0439
Application 08/348,414
Representative independent method claim 18 is reproduced below:
18. A method for making an interconnect substrate comprising the steps of:
forming a substrate having a first surface;
forming a channel in the substrate;
filling the channel with an electrically conductive material; and
cleaving the substrate through the channel with the electrically conductive material to generate a
contact positioned at a nexus and an end surface, thereby bridging the first surface and the end surface.
The following reference is relied on by the examiner:
Hartman et al. (Hartman) 5,282,071 Jan. 25, 1994
Claims 8 to 14 and 18 to 21 stand rejected under 35 U.S.C. § 103. As evidence of
obviousness, the examiner relies upon Hartman alone.2
Rather than repeat the positions of appellants and the examiner, reference is made to the Brief
and the Answer for the respective details thereof.3
OPINION
At the outset, we note that appellants (Brief, page 4) assert that the claims on appeal should
stand or fall together in three groupings: a first group consisting of apparatus claims 8 to 14; a second
We note that claim 22 was rejected by the examiner in the final rejection, but that after reconsideration the2
examiner has withdrawn the obviousness rejection of claim 22 in the Answer (see Answer, page 2). As a result, claim
22 is not being considered here on appeal.
We note that the after final amendment submitted March 27, 1996, was neither entered nor considered as3
per the Answer (see page 2 therein) and the Advisory Action of April 2, 1996.
3
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