Appeal No. 97-1048
Application No. 08/120,998
protection apparatus comprising an integrated
circuit conductive substrate and a separate
protection circuit conductive substrate with a
primary protection circuit on the protection circuit
substrate, the protection circuit having at least
one connection with the integrated circuit for
receiving the high energy pulse and dissipating the
high energy pulse through the protection circuit
substrate to ground.
We agree with appellant that "a printed circuit board
such as substrate 3 of Schott et al is insulative whereas, an
integrated circuit substrate is conductive" (Brief, page 4),
and "[t]here is no suggestion in the references of replacing
the printed circuit board substrate 3 of Schott with the
conductive substrates of Davies" (Brief, page 6). "If the
printed circuit board substrate [of Schott] were replaced with
a conductive substrate [from Davies], all of the leads on all
of the integrated circuit chips would be shorted together and
the integrated circuit chips would not operate" (Brief, page
6). Thus, "[p]rinted circuit board substrates such as that
taught by Schott are not interchangeable with substrates such
as those taught by Davies" (Brief, page 6).
Even if we assume for the sake of argument that it would
have been obvious to one of ordinary skill in the art to
combine the teachings of the references, the combined
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