Appeal No. 97-4420
Application No. 07/995,747
Claim 11 reads as follows:
11. A packaged electronic device structure, comprising:
a plate of thermally and electrically conductive
material;
a microelectronic device chip having a first surface
thereof electrically and thermally connected to said plate,
and containing one or more miniature electronic devices and
one or more bond pads on a second surface thereof;
a plurality of externally accessible conductive leads,
each having one end adjacent to said chip, said leads being
thinner than said plate;
wires interconnecting said leads to said bond pads of
said chip; and a polymer body encapsulating said chip, and
each of said wires, and at least part of said plate;
wherein at least some portions of said plate have a
surface roughness of greater than R =1µm, and other portions
a
have a surface roughness less than R =1µm;
a
wherein at least some portions of said leads have a
surface roughness of greater than R =1µm; and
a
wherein said plate has undercut surfaces in predetermined
areas which contact said polymer body to enhance adhesion
thereof to said plate, and wherein said undercut surfaces
include areas with roughness R greater than 1µm.
a
The Examiner’s Answer cites the following prior art:
Hayakawa et al. (Hayakawa) 4,151,543 Apr. 24,
1979
McShane 5,041,902 Aug. 20,
1991
Hideo 57-96559 June 15, 1982
2
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