Appeal No. 97-4420
Application No. 07/995,747
Japanese Kokai Patent
Nobuhiro 60-231349 Nov.
16, 1985
Japanese Kokai Patent
OPINION
Claims 11-13, 15-21, 23-24, 26, 28, 31-32, and 34 stand
rejected under 35 U.S.C. § 103 as unpatentable over Nobuhiro,
Hayakawa, and McShane. Claims 14 and 22 stand rejected under
35 U.S.C. § 103 as unpatentable over Nobuhiro, Hayakawa,
McShane, and Hideo.
The claims all recite a packaged electronic device
structure having a thermally conductive plate (such as a heat
sink for a power integrated circuit device) with undercut
surfaces having a roughness value greater than one micron.
According to the examiner, Nobuhiro discloses the claimed
device except for the undercut surfaces and the roughness
value. Final rejection (Paper No. 17) at 2. The examiner
stated that it would have been obvious to use undercut
surfaces in Nobuhiro to promote adhesion as taught by McShane,
and a roughness greater than one micron as taught by Hayakawa.
3
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007