Appeal No. 1996-3108
Application No. 08/064,010
DECISION ON APPEAL
This is an appeal from the final rejection of claims
23 through 32 and 46 through 56.
The disclosed invention relates to a heat conductive
layer and a cooling element that dissipate heat from a power
component mounted on a printed circuit board. The heat
conductive layer is applied to the printed circuit board, and
the largest face of the power component is in contact with the
heat conductive layer. The cooling element is spaced from the
power component, and dissipates the heat imparted to the heat
conductive layer by the power component.
Claim 23 is illustrative of the claimed invention, and it
reads as follows:
23. Electrical device comprising:
a printed circuit board (10) carrying an
electronic circuit and at least one power component (11)
to be cooled, each of said at least one power component
(11) having a largest face;
a heat conductive layer (13) applied to said
printed circuit board at least in the vicinity of said
at least one power component (11), each of said at least
3
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