Appeal No. 1996-3108
Application No. 08/064,010
directly on the teachings of the IBM TDB. Appellants’
arguments (revised Brief, pages 14 and 15) to the contrary
notwithstanding, the thermal adhesive in the IBM TDB is a heat
conductive layer “applied to said printed circuit board at
least in the vicinity of said at least one power component”,
and the chip located thereon is a power component in the sense
that power is supplied thereto. Appellants’ argument (revised
Brief, page 15) concerning the “comparatively large distance”
that the FINS (i.e., the cooling elements) are from the chip
is without any merit because specific distances are not
recited in claim 23 on appeal. Appellants’ argument (revised
Brief, page 15) that “the heat conducting layer is not on top
of the nonconducting circuit board substrate is likewise
without merit because Figures 2 and 3 of the IBM TDB clearly
show the thermal adhesive on top of the circuit board
substrate. In the IBM TDB, the copper layered construction of
the circuit board substrate is broadly speaking a “metal
cladding” as set forth in claims 24 and 48, and the thermal
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