Appeal No. 1996-3108
Application No. 08/064,010
one power component resting flat with said largest face
in contact with said heat conductive layer (13); and
a cooling element for dissipation of heat conducted
from said at least one power component (11) by
said heat conductive layer to said cooling element,
said cooling element being spaced from said at least one
power component.
The references relied on by the examiner are:
Ezzo 3,061,760 Oct. 30, 1962
Wigley 1 4,204,247 May 20, 1980
Craft 4,941,067 July 10, 1990
“Heat Sink Assembly for TAB-Mounted Devices,” IBM Technical
Disclosure Bulletin, Vol. 31, No. 6, November 1988, pages 372
and 373 (hereinafter IBM TDB).
Claims 23 through 29, 46 through 51 and 53 stand rejected
under 35 U.S.C. § 102(b) as being anticipated by Ezzo.
1The examiner lists Wigley among the prior art of record
(Answer, page 3), but thereafter states (Answer, page 7) that
Wigley “is hereby withdrawn as a reference.” As a result
thereof, the 35 U.S.C. § 102(b) rejection of claims 23 through
28 and 46 through 52 based upon the teachings of Wigley is
withdrawn, and the 35 U.S.C. § 103 rejection of claims 31, 32,
55 and 56 is now over the teachings of the IBM TDB alone. The
withdrawal of this reference also results in the lack of a
prior art rejection of claim 52.
4
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