Appeal 1997-2572
Application 08/220,562
This polyimide resin was soluble in any organic
ether and ketone solvents.
A 10% cyclohexanone solution of the polyimide resin
was prepared. As described in Example 1, this resin
solution composition was applied to various substrates
and heated at 150E C. for one hour, obtaining a
satisfactory coating having a smooth surface and improved
adherence to each substrate.
11. The Okinoshima polyamic acid must include a 6FDA
component.
B. Discussion
Applicants maintain, and the examiner denies, that the
preamble "consisting essentially" language of applicants'
claim 1 excludes the presence of 6FDA from applicants' claimed
solution. According to applicants, denied by the examiner,
the presence of 6FDA materially affects the properties of
applicants' claimed solutions. We also are told, without as
much as one scintilla of supporting evidence in the record,
that (Appeal Brief, paragraph bridging pages 5-6):
[Applicants] *** have used 6FDA to prepare
polyimidesiloxanes (using diamines outside the scope
of this invention) and have learned that 6FDA
reduces the bond strength. [Applicants] ***
- 6 -
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007