Appeal No. 1997-2846 Application 08/388,599 a third semiconductor layer of the first conductivity type selectively formed in an upper surface portion of the second semiconductor layer, said semiconductor base body having a plurality of trenches arranged substantially in a stripe form along said upper main surface and formed from said upper main surface to said first semiconductor layer, said trench having a gate insulating film formed covering its inner wall and a gate electrode buried in said trench with the gate insulating film interposed therebetween, said second semiconductor layer and said third semiconductor layer being selectivity exposed in said upper main surface interposed between adjacent said trenches, said insulated gate semiconductor device further comprising, a first main electrode electrically connected to both of said second and third semiconductor layers on said upper main surface and insulated from said gate electrode, a second main electrode electrically connected to said lower main surface, and overcurrent protection means for limiting the magnitude of main current flowing between said first main electrode and said second main electrode so as not to exceed a predetermined limit current value, and shape of said third semiconductor layer being set so that a maximum distance Lmax defined as a distance to a point which is farthest from an exposure surface of said second semiconductor layer in said upper main surface among points on an intersection of a boundary plane of said third semiconductor layer and said second semiconductor layer and said trench is given by Vpn > m x Jpr x P x Lmax for built-in pn potential Vpn peculiar to a junction 4Page: Previous 1 2 3 4 5 6 7 8 9 10 11 NextLast modified: November 3, 2007