Appeal No. 1997-3390
Application No. 08/354,384
that a method of plasma spraying over metal substrates such as
steel or copper is disclosed. Merz teaches examples of
different applications for plasma sprayed metallization in
column 1, lines 14 through 25, as blades and other components
in turbines or chemical reaction vessels and pipes. Merz
further teaches in column 3, lines
62 through 65, that the substrate may be preferably treated by
bead or grit blasting to roughen the surface and provide a
strong adhesion. We note that Merz provides several tables
showing results of coating process for different substrate
samples which are specified as either steel or copper.
We do not agree with the Examiner that Merz’ flame
spraying metallization method may be used with the
semiconductor substrate of Santangelo, as recited in
Appellants’ claim 8, to avoid adverse effects on the
substrate. Merz is concerned with coating metal substrates
such as steel and copper to avoid corrosion in adverse
environments. However, Merz is silent with regard to flame
spraying as a low temperature coating that prevents adverse
effects on other substrate materials such as semiconductors.
Therefore, we find no reason for combining the coating process
8
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