Appeal No. 1997-4387
Application 08/308,963
rejection. Claims 11 through 14, the other remaining claims
in the application, have been allowed.
The claimed invention is directed to a mold clamping
device for sealing a semiconductor element in a resin. The
mold clamping device is characterized by a quadrilateral
pantograph- like mechanism for moving the movable platen of
the mold against the stationary platen. Claim 1, appended to
appellants' brief, is further illustrative of the claimed
subject matter.
The references of record relied upon by the examiner
as evidence of obviousness are:
Loscei 4,685,876 Aug. 11, 1987
Goto 5,164,209 Nov. 17, 1992
THE REJECTIONS
Claims 1 through 10, 15, and 16, stand rejected
under 35 U.S.C. § 112, first paragraph, as directed to subject
matter which was not described in the specification in such a
way as to convey that the inventors had possession thereof at
the time the application was filed.
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