Appeal No. 1998-1504
Application 08/373,718
The invention relates to a semiconductor package
wherein one side of the semiconductor die is left exposed, and
thermally conductive fins are independently attached to the
exposed side. In particular, referring to Figure 1,
semiconductor die 110 is surrounded by dielectric package 130
except for its inactive surface. Thermally conductive fins
140 are independently attached to either the die or an
optional metalized layer 112.
Independent claim 1 is reproduced as follows:
1. A semiconductor package, comprising:
a die including electrical circuits;
means for connecting the electrical circuits to a
power source;
a package made of a dielectric material, the package
having the die and the means for connecting mounted therein
such that a portion of the die forms an exterior surface of
the package;
a plurality of independent fins to dissipate heat
into an environment external to the package, the plurality of
independent fins made of a thermally conductive material; and
means for independently attaching each of the
plurality of independent fins to the portion of the die which
forms the exterior surface of the package to provide a direct
thermal path between the die and the plurality of independent
fins positioned entirely outside the package to provide a low
stress thermal joint between the plurality of independent fins
and the die.
2
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