Ex parte FITCH et al. - Page 4




          Appeal No. 1998-1504                                                        
          Application 08/373,718                                                      


          found in the prior art, or by a reasonable inference to the                 
          artisan contained in such teachings or suggestions.  In re                  
          Sernaker, 702 F.2d 989, 995, 217 USPQ 1, 6 (Fed. Cir. 1983).                
          "Additionally, when determining obviousness, the claimed                    
          invention should be considered as a whole; there is no legally              
          recognizable 'heart' of the invention."  Para-Ordnance Mfg. v.              
          SGS Importers Int’l, Inc., 73 F.3d 1085, 1087, 37 USPQ2d 1237,              
          1239 (Fed. Cir. 1995) (citing W. L. Gore & Assocs., Inc. v.                 
          Garlock, Inc., 721 F.2d 1540, 1548, 220 USPQ 303, 309 (Fed.                 
          Cir. 1983), cert. denied, 469 U.S. 851 (1984)).                             
                    With regard to the rejection of claim 1, the                      
          Examiner reasons that Lin discloses the claimed semiconductor               
          package with die 18 forming an exterior surface.  Since Lin                 
          discloses at column 5, lines 24-28 that a heat radiator, heat               
          sink, cold plate or the like can be directly attached to the                
          backside 22 of die 18, it would have been obvious to use                    
          Pitasi’s heat dissipation pins 24 on Lin’s die 18.  (Final                  
          rejection-paragraph 3.)                                                     
                    Appellants argue:                                                 
               There is no evidence that Lin et al. even considered                   
               the use of multiple fins, let alone independent                        
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