Appeal No. 1998-1504
Application 08/373,718
fins, each of which is independently attached to the
die, as recited in claim 1. Pitasi does not cure
these deficiencies. Rather, Pitasi likewise teaches
a single heat dissipator 14 formed as a plate 20 to
which pins 24 are attached. Although Pitasi teaches
the use of a plurality of independent pins, each pin
is not independently attached to the substrate 10,
but rather attached as a group via the heat
dissipator 14 by adhesive layer 22. Hence, the
means for independently attaching, as recited, in
claim 1, and thus the recited multiple independent
fins which are independently
attached to a die, are lacking in the applied art
combination, both in terms of what is disclosed and
what would be motivated by that which is disclosed.
[Reply brief-page 5.] [Emphasis added.]
The Examiner’s position is “One skilled in the
thermal art would realize that a heat radiator, heat sink or
cold plate can be composed of numerous parts as norm in the
thermal enhancement art.” (Answer-page 4.)
We understand and agree with the Examiner that a
heat sink may be composed of several parts. However, as
Appellants have argued, Pitasi has preassembled these parts
(i.e., pins 24) and attached them to substrate 10 as a unit
14, not independently, as claimed. We note the operative
language of claim 1 as follows:
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