Appeal No. 1998-1623
Application 08/433,625
fabricating a semiconductor chip package comprising the step
of bringing a region of solder shown as element 55 in Figure
3, mounted on a chip contact pad of a semiconductor chip shown
as
element 42 into contact with a carrier contact pad shown as
element 60. The Examiner further argues that the solder
region, element 55, is disclosed as having a composition which
includes at least a first component and a second component.
The Examiner further points out that the carrier contact
pad includes a pad region having a composition which includes
at least a third component shown as element 62 in Figure 3.
Appellants argue on page 11 of the brief, that claim 20
requires that the solder region includes at least a first
component and a second component. Appellants argue that this
is not taught or suggested by Brady and that the solder region
includes only a first component and does not have two
components. Appellants concluded that a specific limitation,
9
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