Appeal No. 1998-1623
Application 08/433,625
i.e., the solder ball having two components is not met by
Brady, and hence the rejection under 35 U.S.C. § 102 must fail
since each and every element of the claim is not found in
Brady.
On page 5 of the answer, the Examiner points to column 7,
lines 56-57 which states that the solder region, element 55
shown in Figure 3, may be formed of tin, lead, and indium or
the combinations thereof. The Examiner argues that the
combinations of tin, lead and indium is a three component
solder region that reads on Appellants' claim language found
in claim 20.
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