Appeal No. 1998-3048
Application 08/502,993
Claims 1-5 stand finally rejected under 35 U.S.C. §
102(a) as being anticipated by Shen. The appellants have
grouped all five claims together for purposes of this appeal.
The Invention
The claimed invention is directed to a leadless chip
carrier. Independent claim 1 is reproduced below:
1. A leadless chip carrier package that does
not have a die attach adhesive, comprising:
a printed circuit substrate having a die
mounting area on a first side and having one or more
vent openings located in the die mounting area, the
vent openings extending through the substrate from
the first side to a second opposing side, and the
second side having a plurality of surface mount
solder pads;
a semiconductor die disposed in the die mounting
area and covering the vent openings, the
semiconductor die electrically connected to the
printed circuit substrate by at least one wirebond,
and the semiconductor die lying directly on the
substrate with no die attach adhesive between the
die and the substrate; and
a plastic resin encapsulating the semiconductor
die and providing a compressive force to secure the
semiconductor die in direct and intimate contact
with the printed circuit substrate die mounting
area, the plastic resin further encapsulating the at
least one wirebond and covering portions of the
printed circuit substrate first side.
Claims 2-5 depend either directly or indirectly from claim 1.
2
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007