Appeal No. 1998-3048
Application 08/502,993
that Shen’s disclosed structure is without “die attach”
adhesive between the die and the substrate, as the appellants
have claimed. No explanation has been provided by the
examiner as to how the die element (80) in Shen is attached to
the first or second printed circuit boards.
The appellants’ claims also call for:
a plastic resin encapsulating the semiconductor
die and providing a compressive force to secure the
semiconductor die in direct and intimate contact
with the printed circuit substrate die mounting
area, the plastic resin further encapsulating the at
least one wirebond and covering portions of the
printed circuit substrate first side.
The appellants argue that if anything, the die (80) in
Shen is secured by an adhesive force provided via the epoxy
resin filling the bore hole 61, which is not a compressive
force as is claimed by the appellants. The appellants further
note that a compressive force would tend to dislodge Shen’s
die which has no support on its bottom surface. The examiner
has not provided any satisfactory explanation or response to
these valid points. In that regard, the examiner states
(answer at 4-5):
A recitation with respect to the manner in which a
claimed apparatus is intended to be employed does
not differentiate the claimed apparatus from a prior
art apparatus satisfying the claimed structural
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