The opinion in support of the decision being entered
today was not written for publication and is
not binding precedent of the Board
Paper No. 19
UNITED STATES PATENT AND TRADEMARK OFFICE
_______________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_______________
Ex parte ROBERT C. DOCKERTY,
RONALD M. FRAGA, CIRO N. RAMIREZ,
SUDIPTA K. RAY and GORDON J. ROBBINS
______________
Appeal No. 2000-0159
Application 08/688,073
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ON BRIEF
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Before THOMAS, HAIRSTON and BARRETT, Administrative Patent
Judges.
THOMAS, Administrative Patent Judge.
DECISION ON APPEAL
Appellants have appealed to the Board from the examiner’s
final rejection of claims 1-10 and 21-24.
Representative claim 1 is reproduced below:
1. In a system for connecting a substrate having a low
coefficient of thermal expansion to a printed circuit board
having a materially higher coefficient of thermal expansion using
an array of solder columns and reflow bonding, a supporting
structure with effective heat sink coupling to the substrate,
comprising:
1
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