Appeal No. 2000-0159
Application 08/688,073
an array of high melting temperature solder columns of first
cross-sectional area attached to an array of electrically
transmitting pads on a first side of the substrate;
a set of high melting temperature solder structural support
columns of second cross-sectional area, the second cross-
sectional area exceeding the first by a factor of five or
greater, attached to pads at perimeter locations on the first
side of the substrate;
a plurality of connections between first and second cross-
sectional area solder columns and respectively located surface
mount pads on the printed circuit board using reflowed low
melting temperature solder; and
a heat sink thermally contacting a structural element on a
second side, opposite the first side, of the substrate.
The following references are relied on by the examiner:
Kohara et al. (Kohara) 4,561,011 Dec. 24, 1985
Gaudenzi et al. (Gaudenzi) 5,490,040 Feb. 6, 1996
Appellants’ admitted prior art in Figure 1 discussed at page 6,
line 11 through page 7, line 33.
Claims 1-10 and 21-24 stand rejected under 35 U.S.C. § 103
according to the final rejection. As to claims 1-10 and 21-24,
the examiner relies upon appellants’ admitted prior art in view
of Gaudenzi, with the addition of Kohara as to claims 2-5.
Rather than repeat the positions of the appellants and the
examiner, reference is made to the brief and the answer for the
respective details thereof.
OPINION
We reverse.
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