Appeal No. 2000-2294
Application No. 08/511,425
canceled.
The claimed invention relates to a test circuit for
testing integrated circuits formed on a product wafer
utilizing test circuitry formed on a stimulus wafer referred
to as a circuit distribution wafer (CDW) in Appellants’
specification. A face-to-face connection from the product
wafer to the stimulus wafer is made through a compliant
interconnect media. External connectors and conductors
provided on the stimulus wafer transmit and receive test and
control information to and from an external tester.
Claim 59 is illustrative of the invention and reads as
follows:
59. A test circuit comprising:
a first plurality of input terminals and a first
plurality of output terminals formed on a semiconductor
substrate;
a plurality of buffers coupled between the first
plurality of input terminals and the first plurality of output
terminals on the semiconductor substrate, a portion of the
first plurality of output terminals being coupled to a
compliant interconnect media wherein the compliant
interconnect media is a dielectric material having a plurality
of conductive fibers formed therethrough;
has called attention to this fact in the Brief or Answer.
2
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