Appeal No. 2000-2294
Application No. 08/511,425
enabling disclosure of the temperature sensing feature of
Appellants’ invention, particularly questioning the function
of heating and cooling elements 80 and 82 in providing
accurate temperature sensing results. As pointed out by
Appellants (Brief, pages 12-14), however, the description at
pages 12-16 of the specification in connection with Figures 3-
6 of the drawings provides a detailed disclosure of the
operation of the temperature sensing circuitry including the
interrelationship of signals communicated between the
temperature sensing circuitry 50, heating and cooling elements
80 and 82, and the external tester 104. It is our view, after
reviewing the evidence of record, including Appellants’
detailed description in the specification, that the level of
skill relative to semiconductor wafer testing at the time of
filing of Appellants’ disclosure would enable the skilled
artisan to implement the claimed temperature sensing
operations without undue experimentation. Accordingly, we do
not sustain the Examiner’s rejection of the appealed claims
under the enabling provisions of the first paragraph of 35
U.S.C. § 112.
Turning to a consideration of the Examiner’s 35 U.S.C.
8
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