Appeal No. 1997-3152 Page 2
Application No. 08/116,305
1. A plastic molded package, comprising:
a heat sink having an upper surface and a lower
surface;
a ceramic ring attached to said lower surface of
said heat sink, said ceramic ring having an aperture
exposing a portion of said lower surface of said
heat sink;
a semiconductor die attached to said exposed
portion of said lower surface of said heat sink
using a thermally conductive adhesive;
a lead frame having a plurality of leads
extending outside of said plastic molded package,
said lead frame being attached to said ceramic ring,
said lead frame being formed integrally with a
downset interposer ring which is attached to said
lead frame by a plurality [of] severable tie bars;
and
an encapsulation enclosing said ceramic ring,
said lead frame other than said portion of said
leads outside of said plastic molded package, and
said semiconductor die.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
U.S. References
Chu 4,975,761 Dec. 04,
1990
Zimmerman 5,172,213 Dec.
15, 1992
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