Appeal No. 1997-3152 Page 9
Application No. 08/116,305
The appellants assert (brief, page 10) that Chu’s metal
layer 40, which the examiner identifies as a downset
interposer ring, is not formed integrally with the lead frame
70 (Figure 5). In contrast, metal layer 40 is mounted on
printed circuit board 30 and is separated from lead frame 70
by insulating layer 60. We find that Chu discloses (col. 4,
lines 18-20) a pc board 30 which Chu refers to as a peripheral
pc board. In addition, Chu discloses (col. 4, lines 46-53)
that a layer of insulation 60 is provided to insulate lead
frame 70 from metal layer or bus 40.
We additionally note that Chu further discloses (col 5, lines
12-31) that
[w]hen the spacing between the inner end of leads 72
and the terminal pads 12 on die [10] is large, metal
traces 40a-40f may be formed on pc board 30, by
patterning metal layer 40, for example, as shown in
the embodiment of FIG. 6. Metal traces 40a-40f may
then act as bridges between leads 72 and terminal
pads 12, thereby avoiding the use of long wires
between the leads and the die terminal pads. . . .
In any of the embodiments, electrical connection
may be made to leads 72 on lead frame 70 through
gold wires 76 which are then connected, at their
opposite ends either directly to metal bus layer 40,
to metal traces portions 40a-40f, to terminal pads
42 on pc board 30, or to terminal pads 12 on die 10.
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