The opinion in support of the decision being entered today was
not written for publication and is not binding precedent of
the Board.
Paper No. 14
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte MASAZUMI AMAGAI, KAZUYOSHI EBE
and HIDEO SENOO
____________
Appeal No. 1997-3306
Application No. 08/234,073
____________
ON BRIEF
____________
Before URYNOWICZ, DIXON, and BARRY, Administrative Patent
Judges.
URYNOWICZ, Administrative Patent Judge.
Decision on Appeal
This appeal is from the final rejection of claims 5-
17.
The invention pertains to a process for preparing a
semiconductor wafer for dicing. Claim 5 is illustrative
and reads as follows:
5. A process for preparing a semiconductor wafer for
subsequent dicing into a plurality of semiconductor chips,
said process comprising:
forming a radiation curable adhesive layer on a
substrate film to provide a composite adhesive sheet,
wherein the radiation curable adhesive layer includes
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