Ex parte AMAGAI et al. - Page 1




             The opinion in support of the decision being entered today was                             
             not written for publication and is not binding precedent of                                
             the Board.                                                                                 
               Paper No. 14                                                                             
                          UNITED STATES PATENT AND TRADEMARK OFFICE                                     
                                            ____________                                                
                               BEFORE THE BOARD OF PATENT APPEALS                                       
                                         AND INTERFERENCES                                              
                                            ____________                                                
                            Ex parte MASAZUMI AMAGAI, KAZUYOSHI EBE                                     
                                          and HIDEO SENOO                                               
                                            ____________                                                
                                       Appeal No. 1997-3306                                             
                                   Application No. 08/234,073                                           
                                            ____________                                                
                                               ON BRIEF                                                 
                                            ____________                                                
               Before URYNOWICZ, DIXON, and BARRY, Administrative Patent                                
               Judges.                                                                                  
               URYNOWICZ, Administrative Patent Judge.                                                  
               Decision on Appeal                                                                       
               This appeal is from the final rejection of claims 5-                                     
               17.                                                                                      
               The invention pertains to a process for preparing a                                      
               semiconductor wafer for dicing.  Claim 5 is illustrative                                 
               and reads as follows:                                                                    
               5.  A process for preparing a semiconductor wafer for                                    
               subsequent dicing into a plurality of semiconductor chips,                               
               said process comprising:                                                                 
                     forming a radiation curable adhesive layer on a                                    
               substrate film to provide a composite adhesive sheet,                                    
               wherein the radiation curable adhesive layer includes                                    






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