Appeal No. 1997-3306
Application No. 08/234,073
there is no disclosure in Ishiwata reporting that the
patentees recognized that a residue of adhesive adhering to
a chip upon its removal from a radiation cured adhesive
layer was a problem which subsequently caused defects such
as separation between chips and molding resin in packaged
chips. Accordingly, one of ordinary skill in the art would
not have experimented to obtain adhesive-free wafer chips,
which experimentation purportedly would have been expected
to yield the claimed “combination and concentration of
compounds.”
Whereas Ishiwata does not recognize the problems
caused by adhesive residue adhering to a wafer when it is
removed from a radiation cured adhesive layer as the
examiner contends, we do not agree with his position at
page 4, lines 9-15, of the final rejection that a modulus
of elasticity of not less than 1x109 dyne/cm2 is an inherent
property of the adhesive made by the process of Ishiwata.
It is clear from appellants’ disclosure at pages 27-29 that
the lower limit for the modulus of elasticity of the
radiation polymerizable compound is set to assure that
diced wafer chips A1-A3 do not fall off the adhesive sheet
1, yet can be removed from the sheet without any residual
adhesive contamination.
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