Appeal No. 1997-3306
Application No. 08/234,073
an acrylic adhesive material made of a copolymer
of an acrylic ester and an OH group-containing
polymerizable monomer existing in a quantity of 100 parts
by weight, and
a radiation polymerizable compound having two or
more unsaturated bonds in a quantity of 50-200 parts by
weight;
securing the composite adhesive sheet to the back
surface of a semiconductor wafer having respective circuits
formed on the front surface thereof by pressing the
radiation curable adhesive layer of the composite adhesive
sheet onto the back surface of the semiconductor wafer;
dicing the semiconductor wafer into a plurality of
semiconductor chips each containing a circuit on the front
side thereof while retaining the plurality of semiconductor
chips on the composite adhesive sheet;
irradiating the radiation curable adhesive layer of
the composite adhesive sheet with radiation to cure the
radiation curable adhesive layer such that the radiation
polymerizable compound has an elastic modulus of not less
than 1 x 109 dyne/cm2 after curing;
removing the plurality of semiconductor chips from the
composite adhesive sheet after the adhesive layer thereof
has been cured by irradiation;
mounting the individual semiconductor chips on a lead
frame; and
packaging the individual chips with the back
surfaces thereof in at least partial contact with a molding
resin.
The references relied upon by the examiner are:
Gotman 4,296,542 Oct. 27, 1981
Ebe et al. (Ebe) 5,187,007 Feb. 16, 1993
Ishiwata et al. (Ishiwata) 5,281,473 Jan. 25, 1994
The admitted prior art at page 2 of appellants’
specification.
Claims 5-9 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Ishiwata in view of appellants’
admitted prior art and Gotman.
2
Page: Previous 1 2 3 4 5 6 7 Next
Last modified: November 3, 2007