Appeal No. 1998-0908
Application No. 08/506,292
distribution wafer (CDW) in Appellants’ specification. A face-
to-face connection from the product wafer to the stimulus wafer
is made through a compliant interconnect media. External
connectors and conductors provided on the stimulus wafer transmit
and receive test and control information to and from an external
tester.
Claim 57 is illustrative of the invention and reads as
follows:
57. A method for stimulating a product wafer using a
stimulus wafer, the method comprising the steps of:
providing the product wafer wherein the product wafer
comprises a plurality of product integrated circuits which are to
be stimulated, the product wafer having a selectively exposed top
conductive layer of material coupled to the product integrated
circuits;
providing the stimulus wafer wherein the stimulus wafer
comprises a plurality of stimulus circuits wherein at least one
stimulus circuit within the plurality of stimulus circuits
corresponds to one product integrated circuit within the
plurality of product integrated circuits, the stimulus wafer
having a selectively exposed top conductive layer of material
coupled to the stimulus circuits; and
positioning a compliant interconnect media between product
wafer and the stimulus wafer, the compliant interconnect media
coupling the selectively exposed top conductive layer of material
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