Appeal No. 1998-0908
Application No. 08/506,292
As to King '241, we note that the interconnect member 13 is
disclosed as being either a discrete element or an interconnect
pattern integrated or formed on top of integrator substrate 20
(King '241, column 5, lies 58-65). King '241 further
illustrates, in Figure 3, active circuitry on substrate 20 which
includes interconnect pads 60 connected to surface leads 74-82.
Given this disclosure, we fail to see what characteristic of
substrate 20 in King '241 would justify Appellants’ position that
it is not a “wafer” as claimed.
We are equally unpersuaded by Appellants’ further arguments
which (Brief, page 20) attack the Examiner’s establishment of
proper motivation for the proposed combination of either of the
King references with Moriya. Appellants assert that Moriya is
concerned with the testing of packaged integrated circuits, in
contrast to King '241 which tests on a wafer scale level and
King '405 which, in their view, describes no testing at all.
Contrary to Appellants' contention, we do not interpret the
Examiner’s position as suggesting the bodily incorporation of
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