Appeal No. 1998-2144
Application No. 08/568,847
BACKGROUND
The invention is directed to a module containing an integrated circuit chip, with the
module including columns capable of transferring heat. Claim 21 is reproduced below.
21. In a module that has a case with electrical contacts thereon and contains an
integrated circuit chip and a circuit board therein which circuit board and chip have
electrical connections on facing surfaces thereof formed by a controlled collapse
chip contact connection method and which board has electrically conducting vias
therein for the conduction of electricity to and from said connections to the electrical
contacts, the improvement comprising:
columnar means formed of additional conductive vias, in said circuit board,
configured for the transfer of heat in the circuit chip through the electrical
connections on the facing surfaces of the circuit board and chip through the circuit
board towards the case of the module; and
contact means on the interior of the case to transfer heat from the columnar
means to the case.
The examiner relies on the following references:
Sumida 5,543,661 Aug. 6, 1996
(filed May 24, 1995)
Thermal Enhancement of Thermal Cap, 31 IBM Technical Disclosure Bulletin No. 4, 372-
73, Sept. 1988 (the IBM TDB).
Claims 21-34 and 36 stand rejected under 35 U.S.C. § 103 over the IBM TDB and
Sumida. Claim 35 has been objected to as depending from a rejected claim, but deemed
to contain allowable subject matter. Claims 1 through 20 have been canceled.
We refer to the Final Rejection (Paper No. 10) and the Examiner's Answer (Paper
No. 15) for a statement of the examiner's position and to the Brief (Paper No. 14) and the
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