Appeal No. 1998-2351
Application 08/393,113
surface. Claim 1, directed toward the method, is
illustrative:
1. A method for preparing a substrate member having a
film layer that can be modified to define bumps or pits
corresponding with true or complement logic digital data
values comprising the steps of:
providing a substrate member for supporting a data film
layer;
forming a recess in the surface of the substrate for
receiving a quantity of viscous material;
supplying a quantity of viscous material into the recess;
causing said viscous material to harden in a layer having
a substantially flat, smooth support surface for supporting a
data film layer; and,
depositing a data film layer onto the smooth support
surface of the hardened layer in a thickness sufficient such
that when the data film layer is exposed to a data recording
step at least one of data bumps or pits can be formed on or in
said data film layer.
THE REFERENCES
McHugh 390,611 Oct. 2,
1888
Egleson 1,691,708 Nov. 13,
1928
West 1,983,720 Dec. 11,
1934
de Graaf et al. (de Graaf) 5,188,863 Feb. 23,
1993
2
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007