The opinion in support of the decision being entered today was not written for
publication and is not binding precedent of the Board.
Paper No. 24
UNITED STATES PATENT AND TRADEMARK OFFICE
_____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_____________
Ex parte CHUEN-DER LIEN
_____________
Appeal No. 1999-0866
Application No. 08/742,704
______________
ON BRIEF
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Before THOMAS, KRASS, and GROSS, Administrative Patent Judges.
THOMAS, Administrative Patent Judge.
DECISION ON APPEAL
Appellant has appealed to the Board from the examiner's
final rejection of claims 12 through 23, 35 through 38 and 55.
Representative claim 12 is reproduced below:
12. A process for forming an interconnect
structure, comprising the steps of:
depositing a first conductive layer overlying one
surface of a semiconductor substrate;
forming a first dielectric layer overlying said
first conductive layer;
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