Appeal No. 1999-0866
Application No. 08/742,704
under the second paragraph of 35 U.S.C. § 112 because of the
following defects we note with respect to independent claim 12
on appeal. Claim 12 recites the methodology of forming an
interconnect structure by first depositing various layers,
then selectively removing certain first portions of them,
yielding an interconnect structure of the remaining or second
portions thereof. This interconnect structure is stated to
comprise three elements: a first conductive lead formed by a
second portion of a first conductive layer, a second
conductive plug formed by a second portion of the first
conductive plug and a second dielectric layer formed by a
second portion of the first dielectric layer. The claim ends
with the wherein clause defining more specifically the second
conductive plug and doing so by defining its various surfaces
and sides. Based upon our study of the written description
portion of the specification as well as its attendant drawing
figures, the recitation of “a third side in contact with said
second dielectric layer, said second side and said third side
being adjacent to one another” cannot reasonably be discerned.
Appellant makes specific reference to this noted
5
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007