Ex parte CHAUG et al. - Page 2




                 Appeal No. 1999-1539                                                                                                                   
                 Application 08/584,118                                                                                                                 




                          The invention is directed to a magnetic recording head                                                                        
                 having a substrate and closure element separated by a first                                                                            
                 gap and comprising a recording track layer deposited on the                                                                            
                 substrate, and a patterned gap layer deposited on a flat                                                                               
                 surface of the closure element.  The first gap layer has a                                                                             
                 known nonplanar topography along a side facing the flat                                                                                
                 surface of the closure element.  In order to prevent the                                                                               
                 creation of localized air gaps within the first gap layer and                                                                          
                 the closure element, the patterned gap layer is formed on the                                                                          
                 planar surface of the closure element with a topography                                                                                
                 inverse to that of the first gap layer.  As a result, the gap                                                                          
                 separating the substrate and the closure element is                                                                                    
                 substantially filled.  Because the localized air gaps are                                                                              
                 filled to provide structural support for the closure element,                                                                          
                 the present invention is able to effectively reduce and/or                                                                             
                 eliminate micro chipping during lapping or grinding of the                                                                             
                 closure element at the time of manufacture.  A further under-                                                                          



                          1(...continued)                                                                                                               
                 7, 1998.                                                                                                                               
                                                                           2                                                                            





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