Appeal No. 2000-2143 Page 2
Application No. 08/743,405
The appellants’ invention relates to a multilayer thin film
(MLTF) structure containing electronic packages such as multi-
chip modules (specification, p. 1). A copy of the claims under
appeal is set forth in the appendix to the appellants’ brief.
The prior art
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Bhatia et al. (Bhatia) 5,243,140 Sep. 7, 1993
Mohsen 5,371,390 Dec. 6, 1994
The rejections
Claims 1 to 5 stand rejected under 35 U.S.C. § 102(b) as
anticipated by or in the alternative under 35 U.S.C. § 103 as
obvious over Bhatia.
Claims 1 to 5 and 16 to 20 stand rejected under 35 U.S.C.
§ 103 as being unpatentable over Mohsen in view of Bhatia.
Rather than reiterate the conflicting viewpoints advanced by
the examiner and the appellants regarding the above-noted
rejections, we make reference to the answer (Paper No. 20) for
the examiner's complete reasoning in support of the rejections,
and to the brief (Paper No. 19) for the appellants’ arguments
thereagainst.
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