Appeal No. 2000-2143 Page 6 Application No. 08/743,405 Mohsen discloses that bonding pads are distributed in a regular pattern to make the bonding pads as general purpose as possible and as such, like Bhatia, Mohsen includes additional metallurgy on the surface of the top layer. Therefore, we will not sustain this rejection for the same reasons stated above for the first rejection. The decision of the examiner is reversed. REVERSED JEFFREY V. NASE ) Administrative Patent Judge ) ) ) ) ) BOARD OF PATENT MURRIEL E. CRAWFORD ) APPEALS Administrative Patent Judge ) AND ) INTERFERENCES ) ) ) JENNIFER D. BAHR ) Administrative Patent Judge ) MEC/jrgPage: Previous 1 2 3 4 5 6 7 8 NextLast modified: November 3, 2007