Appeal No. 2001-0106
Application 08/855,811
Pleuddemann or Hahn et al for their documented beneficial coupling and/or
adhesion promoting function in/in [sic] conjunction with the process of Bruder.
(Examiner’s Answer, page 6, lines 9-15).
The Appellants, on the other hand, note the following:
As pointed out in the [Appeal] brief, it is true that Bruder does teach the use of a
conductive adhesive agent against the metallic layer. However, Bruder does not
suggest using a coupling agent. Moreover, it is true that Thomson does suggest
using a coupling agent but, for the purpose of improving adhesion with respect to
a nonconductive adhesive against a metal substrate. (Reply Brief, page 2, lines
15-19)
The Appellant goes on to dispute the prima facie case of obviousness, stating
that the “reference performs a step for a different purpose and which does not recognize
the problem solved by the applicants [prevention of electrical degradation over time]”
(Reply Brief, page 2, lines 23-24). Further, the Appellants note, via the declarations of
Egitto and Cain, that “the coupling agents do not improve the adhesion in a significant
way between the electrically conductive adhesive and the metal substrate.” (Reply Brief,
page 2, lines 27-29)(Emphasis in Original).
The Appellants sum up their position at Reply Brief, page 3, lines 7-10, as
follows:
[A]ll the prior art references which suggest the use of the coupling agent suggest
it for the use in improving adhesion, which it does not do in the instant case, but
none suggest it for improving the resistance to degradation of electrical
properties over time, which it does do.
The Examiner disputes the Declaration conclusion, noting “that the conductive
adhesive envisioned for use by appellants fractures internally (where no coupling
agent/function is present is held/seen not to (necessarily) indicate that there is no
adhesion improvement at the metal/conductive adhesive interface.” (Examiner’s
Answer, page 8, lines 6-9).
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