Ex Parte EGITTO et al - Page 6


             Appeal No. 2001-0106                                                                                      
             Application 08/855,811                                                                                    
             application recite a device, an electrical component, and a process for improving                         
             electrical properties of a bond.                                                                          
             Discussion                                                                                                
                    Issue I.  The Rejections over Thomson, Pleuddemann and Hahn Individually                           
                    We address the single reference combined §102/§103 rejections first.  In the                       
             Examiner’s Answer, Page 4, lines 6-14, the Examiner states that:                                          
                            Claims 1, 3, 5, 8 and 10 stand rejected under 35 U.S.C. 102(b) as                          
                    anticipated by or, in the alternative, under 35 USC 103 as being unpatentable                      
                    over the teachings of the U.S. Patent to Thomson.                                                  
                            Thomson (U.S. 3,715,371) discloses that it is known to bond an inorganic                   
                    (e.g. metal) substrate to any polymeric material via the interposition                             
                    therebetween of an (e.g. amino containing) organosilane compound/coupling                          
                    agent. (abstract, column 1, line 7 through column 2, line 59, column 4, line 14                    
                    through column 5, line 65).  Any differences which might possibly/conceivably                      
                    exist between this envisioned, claimed invention and the teachings of this                         
                    reference do NOT constitute patentable differences. [Capitalization in original]                   
                    In response, the Appellants note that Thomson is “absolutely silent about                          
             bonding of an electrically-conductive adhesive to a metal substrate”  (Appeal Brief, page                 
             7, lines 2-3).                                                                                            
                    Turning now to the Pleuddemann and Hahn rejections, we note that the                               
             Examiner stated at page 4, line 18 – page 5, line 5 of the Examiner’s Answer, that:                       
                    Plueddemann (U.S. 3,956,353-abstract, column 1, lines 23-56, column 2, lines                       
                    50-66, column 3, lines 16-23) and Hahn et al (U.S. 5,002,808- abstract, column                     
                    1, lines 16-48, column 3, lines 44-60, column 6, lines 41-49) both disclose that is                
                    it known to bond an inorganic (e.g. metal) substrate to any of a wide variety of                   
                    polymeric materials via the interposition therebetween of an organosilane                          
                    compound/coupling agent.  The Examiners position is that any differences which                     
                    might possibly/conceivably exist between this envisioned, claimed invention and                    
                    the teachings of either of these references do not constitute patentable                           
                    differences.                                                                                       
                    The Appellants position (Appeal Brief, page 11, lines 3-4) is that:                                



                                                          6                                                            



Page:  Previous  1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  Next 

Last modified: November 3, 2007