Appeal No. 2001-0106
Application 08/855,811
Thomson, Pleuddemann, Hahn, Iliou, or Bruder, in the rejections as
outlined above.
DELIBERATIONS
Our deliberations in this matter have included evaluation and review of the
following materials:
(1) the instant specification, including all of the claims on appeal;
(2) Appellant’s Main Brief (Paper No. 17) and the Reply Brief (Paper No. 19);
(3) the Examiner’s Answer (Paper No. 18);
(4) the above-cited prior art references (including two newly cited references);
and
(5) the application’s prosecution history, including the Declarations of Frank
Egitto (attached to Paper No. 13) and Steven Cain (Paper No. 14).
On consideration of the entire record, including the above-listed materials, we
reverse in part, affirm in part, and make two new grounds of rejection.
DISCUSSION
The Invention
Appellants’ invention relates to a technique for improving the electrical properties
of the adhesive bond formed between a metal surface and an electrically conductive
adhesive. The Appellants’ utilize organic coupling agents (specifically organosilanes,
organonitrates, and organozirconates) to treat the metal surface prior to the application
of an electrically conductive adhesive to the surface, forming a layer. The claims of the
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