Appeal No. 2001-0106
Application 08/855,811
REPRESENTATIVE CLAIM
Claims 1, 6, and 8, which are illustrative of the subject matter on appeal, read as
follows:
1. A device comprising a metal substrate, an electrically-conductive adhesive
bonded to said metal substrate, and a layer of a coupling agent selected from the
group of organosilanes, organotitanates, and organozirconates between said
substrate and said adhesive, said coupling agent comprising a material bonded
to said metal and also reacted with said electrically conductive adhesive.
6. An electrical component comprising a metal substrate, a layer of coupling agent
selected from the group of organosilanes, organotitanates, and organozirconates
on said substrate, an adhesive bonded to said layer of coupling agent, and an
electrically-conductive adherend bonded to said adhesive, said coupling agent
comprising a material bonded to the metal of said substrate and also reacted with
said adhesive.
8. A process for improving the electrical properties of the bond formed between a
metal substrate and an electrically conductive adhesive, said process comprising
applying to said substrate a coupling agent selected from the group of
organosilanes, organotitanates, and organozirconates, prior to the application of
said adhesive thereto, said coupling agent comprising a material capable of
bonding to said metal and also capable of reacting with said adhesive, and
applying a conductive adhesive to said coupling agent.
THE REFERENCES
In rejecting the appealed claims under obviousness-type double patenting, the
Examiner relies on the following references:
Thomson (Thomson) 3,715,371 Feb. 6, 1973
(filed Nov. 16, 1971)
Pleuddemann (Pleuddemann) 3,956,353 May 11, 1976
(filed Jul. 15, 1974)
Hahn et al. (Hahn) 5,002,808 Mar. 26, 1991
(filed Feb. 8, 1989)
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Next
Last modified: November 3, 2007