Appeal No. 2001-0249
Application No. 08/786,494
board and a method of making the board. In particular, the
invention includes a selection of low modulus material and a
height of an interconnect region such that their combination
provides reduced interfacial shear stresses in the printed
circuit board.
Representative independent claim 17 is reproduced as
follows:
17. A printed circuit board having at least two conductor
layers and adapted for reduced interfacial shear stresses,
comprising:
a laminate substrate having:
a top layer forming a first major surface and having a
first conductor pattern formed thereon;
a bottom layer forming a second major surface opposed to
the first major surface and having a second conductor pattern
formed thereon; and
a middle layer selectively etched to isolate selected
portions of the first and second surfaces and define interconnect
regions therebetween having a predetermined height;
a compliant adhesive layer comprised of a low modulus
material having a first major surface secured to a second major
surface of the substrate, and a second major surface; and
a base having a first major surface secured to the
second major surface of the adhesive layer;
wherein the low modulus material and the height of the
interconnect regions are selected such that their combination
provides said reduced interfacial shear stresses.
-2–
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