Appeal No. 2001-0249
Application No. 08/786,494
argue only the rejection under 35 U.S.C. 102(b), contending that
the recitation, in claim 17, of a printed circuit board “having
at least two conductor layers and adapted for reduced interfacial
shear stresses, ...wherein the low modulus material and the
height of the interconnect regions are selected such that their
combination provides said reduced interfacial shear stresses” and
the recitation, in claim 33, of a printed circuit board, “having
at least two conductor layers and adapted for reducing between
the layers interfacial shear stresses to below a predetermined
stress factor...wherein the modulus material of the base and the
height of the interconnect regions are selected such that their
combination provides the reduced interfacial shear stresses below
the predetermined stress factor,” distinguish over Livshits.
With regard to the rejection under 35 U.S.C. 103, appellants
only state that the claims subject to this rejection depend from
and include the limitations of claims 17 and 33 and that these
claims are patentable for the same reasons as alleged for claims
17 and 33.
Accordingly, all the claims will stand or fall with
independent claims 17 and 33. Thus, we only need to consider the
rejection of these independent claims under 35 U.S.C. 102(b).
With regard to the rejection under 35 U.S.C. 102(b), it is
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