Ex parte PENG et al. - Page 1




                The opinion in support of the decision being entered today was not    
                written for publication and is not binding precedent of the Board.    
                                                                 Paper No. 13         
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     

                          Ex parte JUN-KAI PENG, WEI-KUN YEH                          
                                  and CHIARN-LUNG LEE                                 
                                     ____________                                     
                                 Appeal No. 2001-1700                                 
                              Application No. 09/160,964                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     

          Before, OWENS, WALTZ and KRATZ, Administrative Patent Judges.               
          KRATZ, Administrative Patent Judge.                                         


                                  DECISION ON APPEAL                                  
               This is a decision on appeal from the examiner's final                 
          rejection of claims 1-7, which are all of the claims pending                
          in this application.                                                        
                                     BACKGROUND                                       
               Appellants' invention relates to a method for processing               
          a semiconductor wafer wherein an anisotropic etch forms a                   
          groove in  a device surface thereof.  The groove has                        






Page:  1  2  3  4  5  6  7  8  9  10  Next 

Last modified: November 3, 2007